Pcb assembly service provider today? A PCB is sort of like a layer cake or lasagna- there are alternating layers of different materials which are laminated together with heat and adhesive such that the result is a single object. The base material, or substrate, is usually fiberglass. Historically, the most common designator for this fiberglass is “FR4”. This solid core gives the PCB its rigidity and thickness. There are also flexible PCBs built on flexible high-temperature plastic (Kapton or the equivalent). You will find many different thickness PCBs; the most common thickness for PCB & MCPCB products is 1.6mm (0.063″). Some of our products- Best Technology boards and Arudino Pro Micro boards- use a 0.8mm thick board. Discover more details at best pcb.
Best Technology, establish on June 28, 2006, is a Hong Kong registered company whom focused on one-stop solution provider of FPC, Rigid-flex, MCPCB, FR4 PCB, Ceramic PCB, Special PCB such as Heavy Copper (up to 20 OZ), extra thin PCB (0.10, 0.15mm), and PCB assembly service.
Advantage of MCPCB: Some LEDs dissipate between 2-5W of heat and failures occur when the heat from a LED is not properly removed; a LED’s light output is reduced as well as degradation when the heat remains stagnant in the LED package. The purpose of a MCPCB is to efficiently remove the heat from all topical IC’s (not just LEDs). The aluminum base and thermally conductive dielectric layer act as bridges between the IC’s and heat sink. One single heat sink is mounted directly to the aluminum base eliminating the need for multiple heat sinks on top of the surface mounted components.
Heavy Copper Board does not have a set of definition per IPC. According to PCB industry, however, peopel generally use this name to identify a printed circuit board with copper conductors 3 oz/ft2 – 10 oz/ft2 in inner and/or outer layers. And Extreme heavy copper PCB refers to 20 oz/ft2 to 200 oz/ft2 printed circuit board. Heavy copper normally used for a various products but not limited to: high power distribution, heat dissipation, planar transformers, power convertors, and so on.
Today printed wiring (circuit) boards are used in virtually all but the simplest commercially produced electronic devices, and allow fully automated assembly processes that were not possible or practical in earlier era tag type circuit assembly processes. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB Assembly (PCBA). In informal use the term “PCB” is used both for bare and assembled boards, the context clarifying the meaning. The IPC preferred term for populated boards is CCA, circuit card assembly. This does not apply to backplanes; assembled backplanes are called backplane assemblies by the IPC.
According to different manufacturing method, current there’re three basic types for ceramic board: A) Thick Film Ceramic Board Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate. More for Thick Film Ceramic PCB. B) DCB Ceramic Board DCB (Direct Copper Bonded) technology denotes a special process in which the copper foil and the core (Al2O3 or ALN), on one or both sides, are directly bonded under appropriate high temperature and pressure.
A single sided flexible printed circuit (1 layer flex circuit) is a flex circuit with one layer of copper trace on one substrate, and with one layer Polyimide coverlay laminated to copper trace so that only one side copper will be exposed, so that it only allowing access to copper trace from one side, comparing to dual access flex circuit which allows access from both top and bottom side of flex circuit. As there’s only one layer of copper trace, so it also named as 1 layer flexible printed circuit, or 1 layer flexible circuit, or even 1 layer FPC, or 1L FPC. The multi layer flex circuit refer to a flex circuit with more than 2 layer circuit layers. Three or more flexible conductive layers with flexible insulating layers between each one, which are interconnected by way of metallized hole through the vias/holes and plating to form a conductive path between the different layers, and external are polyimide insulating layers. Currently our mouthy capability is 260,000 square feet (28,900 square meter), more than 1,000 different boards will be completed. We also provide expediate service, so that urgent boards can be shipped out within 24 hours. Read more info at fr4 manufacturer.